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3D ICThe Future Of Semiconductor Design Author: Siemens Digital Industries Software
As the semiconductor industry struggles with the limits of Moores Law, traditional monolithic scaling is no longer enough to meet performance, power, area and cost demands in technology, design, analysis, and manufacturing. 3D IC by Siemens is your go-to podcast for exploring the cutting-edge world of 3D IC packaginga revolutionary approach reshaping semiconductor design, system integration, and heterogeneous computing. Join industry leaders, engineers, and innovators as we break down advanced IC packaging solutions like 2.5D/3D IC, FCBGA, FOWLP, and more. Discover how chiplets, multi-die integration, and high-bandwidth memory (HBM) are driving higher performance, lower power consumption, and scalable architectures. In each episode, we dive deep into the challenges and opportunities of IC design and manufacturing, including: Roadmap for advanced packaging and heterogeneous integration in semiconductor scaling Mainstream adoption of 3D ICkey challenges and breakthroughs Optimizing micro-architecture and integration platforms for performance and efficiency Strategic planning of chiplets and interposers for hierarchical device integration Leveraging early predictive multi-physics analysis to enhance design accuracy Automating design and routing for RDL-based fan-out wafer-level packaging (FOWLP) Exploring glass substrates for superior electrical and thermal performance Developing test-vehicles and daisy chain designs for architectural validation Ensuring reliability and manufacturability in 3D IC heterogeneous integration Mastering Signal Integrity (SI) and Power Integrity (PI) Analysis for high-speed systems Managing thermal challenges in stacked die architectures Subscribe now and stay ahead in the world of 3D IC. Learn more: Siemens 3D IC Packaging Solutions Language: en Contact email: Get it Feed URL: Get it iTunes ID: Get it |
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Nothing's for Free: Piyush Sancheti on the Real Trade-Offs Behind 3D IC Adoption
Wednesday, 12 August, 2026
From AI accelerators to automotive silicon, what does it actually take — organizationally, economically, and technically — to make 3D IC work in the real world? What you’ll learn... (01:59) What's already shipping: real-world 2.5D and 3D IC products in data centers, mobile devices, and AI accelerators — and why linear, monolithic SoC flows no longer scale for 3D IC design (05:44) Is 3D IC the right economic decision? Weighing ROI and the two forks in the road (08:24) Geopolitics and the shift from single-foundry lock-in to a fragmented, multi-supplier ecosystem (11:01) The cultural shift: bringing electrical, mechanical, and materials science disciplines together (13:54) Why EDA is the glue for multidisciplinary 3D IC design (14:32) STCO explained: shifting design decisions left with a unified "cockpit" view (18:36) Inside the expanded Siemens–NVIDIA AI partnership announced at CES 2026 (20:03) Why system companies are moving into custom silicon — Meta's MTIA and Tesla's Dojo 3 (24:11) Looking ahead: integrated photonics, glass interposers, and wafer-scale computing (29:37) Physical AI at the edge: latency, power, and reliability requirements More about this episode... In this episode of the Siemens 3D IC Podcast, closing out the season, host Tova Levy speaks with Piyush Sancheti, VP of Central Engineering Solutions (3D IC) at Siemens EDA, for a full-circle look at where 3D IC adoption stands today. Piyush explains that 3D IC has moved well past research: 2.5D packaging is now mainstream in AI and HPC, and true 3D stacking is moving beyond HBM into logic dies. But the biggest lesson for early adopters isn't technical, it's organizational: linear, monolithic SoC flows don't scale once packaging, multi-physics, and manufacturing all have to be considered together from day one. That theme carries through the economics of adoption (there's no one-size-fits-all, it depends on end market), the geopolitical push toward a diversified, multi-supplier ecosystem, and the cultural shift needed to unite electrical, mechanical, and materials engineering teams. Piyush also unpacks STCO (system technology co-optimization) as a shift toward earlier design-space exploration, Siemens' unified "cockpit" vision for 3D systems, and the expanded Siemens–NVIDIA partnership announced at CES 2026. He closes by looking at why system companies like Meta (MTIA) and Tesla (Dojo 3) are building their own custom silicon, what's next for the industry (co-packaged optics, glass interposers, wafer-scale computing), and how physical AI at the edge is reshaping 3D IC's latency and power requirements. Ideal for: 3D IC architects, EDA users, chip and system-level design leaders, semiconductor strategists tracking geopolitical and supply-chain shifts, and anyone trying to understand where multi-die integration is headed next. Connect with Tova Levy LinkedIn Website Connect with Piyush Sancheti LinkedIn Siemens EDA
